Square Polycrystal Silicon Wafer For Solar Panel
The manufacturing process of polycrystalline silicon wafers is relatively simple and can be mass-produced, so it is widely used in the manufacture of solar panels.
Description
ZhenAn International Co., Limited is one of the most reliable manufacturers and suppliers of square polycrystal silicon wafer for solar panel in China. With abundant experience, we warmly welcome you to wholesale discount square polycrystal silicon wafer for solar panel in stock here from our factory. Quality products and reasonable price are available.
Description
Polycrystalline silicon wafers are a material used to make solar cells. It is composed of many small crystals, which is cheaper to manufacture than single crystal silicon wafers, but its electrical properties are slightly inferior to single crystal silicon wafers.
Polysilicon Wafers Features
▼Low manufacturing cost: Compared to monocrystalline silicon wafers, polycrystalline silicon wafers are cheaper to manufacture because they do not require a single crystal growth process like monocrystalline silicon wafers.
▼Good photoelectric performance: Although the electrical performance of polycrystalline silicon wafers is slightly inferior to that of monocrystalline silicon wafers, its photoelectric conversion efficiency is still very high, which can reach about 20%.
▼Good stability: polysilicon wafers have good stability and can maintain the stability of their electrical and photoelectric properties for a long time.
Large-scale production: The manufacturing process of polycrystalline silicon wafers is relatively simple and can be mass-produced, so it is widely used in the manufacture of solar panels.
Specification
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MATERIAL PROPERTIES |
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PROPERTY |
SPECIFICATION A |
REFERENCED STANDARD A |
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GROWTH METHOD |
CZ |
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CRYSTAL ORIENTATION |
<100>±2º |
ASTM F26 |
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DONOR TYPE |
P/boron |
ASTM F42 |
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OXYGEN CONCERTRATION |
≤1.0x1018 atoms/cm3 |
ASTM F1188 measured on center |
|
CRABON CONCENTRATION |
≤5.0x1016 atoms/cm3 |
ASTM F1391 measured on center of slug |
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DISLOCATION DENSITY |
≤3000pcs/cm3 |
ASTM F47-88 measured on slug in ingot tail |
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ELECTRICAL PROPERTIES |
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RESISITIVITY |
1.0-3.0ohm-cm |
ASTM F43 |
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LIFETIME |
≥10us |
≥10us |
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GEOMETRY |
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GEOMETRY |
SQUARE |
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THICKNESS |
180um±20um |
ASTM F533/EDGE 6MM 4, CENTER 1 |
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TTV |
≤30um |
ASTM F567/EDGE 6MM 4, CENTER 1 |
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DIMENSION |
156±0.5um |
|
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SAW MARKS |
depth≤15um, depth≤15um |
ASTM F567 |
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SURFACE QUALITY |
Cleaned, no grease stains |
Profilometer/sj-210 |
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EDGE CHIPPING |
depth≤0.3mm,length≤0.5mm |
By sight |
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INDENTATION |
Depth≤0.3um, length≤0.5mm, no V shape cave, total≤2 |
By sight |
|
BOW |
<40um |
Astm f657;by non-contact capacitive |
|
ROUGHNESS(RA) |
<1.0um |
Profilometer/sj-210 |
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PACKAGE AND LABELS |
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PACKAGE |
400PCS/PACKAGE |
100PCS/BAG |
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LABELS |
PART NO. P.O. NO. NO OF WAFER, DIMENSION |
TEMP, HUMIDITY |

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