Tungsten Sputtering Target

ZhenAn Tungsten Sputtering Manufacturers

Tungsten Sputtering Description

An orthogonal magnetic field and an electric field are added between the sputtered target (cathode) and the anode, and the required inert gas (usually Ar gas) is filled in the high vacuum chamber. Under the action of the electric field, the Ar gas is ionized into positive Ions and electrons, a certain negative high voltage is added to the target.

The electrons emitted from the target are affected by the magnetic field and the ionization probability of the working gas increases, forming a high-density plasma near the cathode.

Ar ions are driven by the Lorentz force. It accelerates towards the target surface and bombards the target surface at a very high speed, so that the sputtered atoms on the target follow the principle of momentum conversion and fly away from the target surface with high kinetic energy to the substrate to deposit a film.

ZhenAn offers a comprehensive range of sputtering targets, evaporation sources and other deposition materials, listed by material throughout the site. Find below budget pricing for sputtering targets and deposition materials that match your requirements. Actual prices may vary due to market fluctuations.

Tungsten (W) General Information

Tungsten, also known as tungsten, is one of the densest elements in the world. It has a density of 19.3 g/cc, a melting point of 3,410°C, and a vapor pressure of 10-4 Torr at 2,757°C.

The appearance is off-white and shiny. It is known to have the highest melting point of all metals, and its characteristic hardness makes it difficult to machine and forge in its pure form.

Tungsten is commonly used to make electric filaments. Tungsten carbide is found in drill bits, saws and jewelry. Tungsten is evaporated under vacuum and is used in the production of semiconductors, fuel cells and sensors.